MCF54450CVM180 vs XPC850DSLCZT50BU feature comparison

MCF54450CVM180 NXP Semiconductors

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XPC850DSLCZT50BU Freescale Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.A.2 5A991
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP NXP
Address Bus Width 32 26
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 60 MHz 50 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 23 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 260 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.35 mm
Speed 180 MHz 50 MHz
Supply Voltage-Max 1.65 V 3.465 V
Supply Voltage-Min 1.35 V 3.135 V
Supply Voltage-Nom 1.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 17 mm 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 4
Part Package Code BGA
Package Description BGA, BGA256,16X16,50
Pin Count 256

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