MPC860DTZQ50D4
vs
XPC860ENZP50D4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Package Description
,
BGA, BGA357,19X19,50
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
SoC
Base Number Matches
2
3
Part Package Code
BGA
Pin Count
357
ECCN Code
3A991.A.2
JESD-30 Code
S-PBGA-B357
Length
25 mm
Number of Terminals
357
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA357,19X19,50
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.05 mm
Supply Voltage-Max
3.465 V
Supply Voltage-Min
3.135 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
Technology
CMOS
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
25 mm
Compare MPC860DTZQ50D4 with alternatives
Compare XPC860ENZP50D4 with alternatives