XPC860ENZP50D4
vs
MPC860SRVR50D4R2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA357,19X19,50
25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357
Pin Count
357
357
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
Length
25 mm
25 mm
Number of Terminals
357
357
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA357,19X19,50
BGA357,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.05 mm
2.52 mm
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
SoC
MICROPROCESSOR, RISC
Base Number Matches
3
2
Pbfree Code
Rohs Code
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
50 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-609 Code
e1
Low Power Mode
YES
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
245
Speed
50 MHz
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
30
Compare XPC860ENZP50D4 with alternatives
Compare MPC860SRVR50D4R2 with alternatives