MPC860DTZQ50D4
vs
MPC860SRVR50D4R2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
,
25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
357
ECCN Code
3A991.A.2
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
50 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B357
JESD-609 Code
e1
Length
25 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of Terminals
357
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA357,19X19,50
Package Shape
SQUARE
Package Style
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Seated Height-Max
2.52 mm
Speed
50 MHz
Supply Voltage-Max
3.465 V
Supply Voltage-Min
3.135 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
Technology
CMOS
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
25 mm
Compare MPC860DTZQ50D4 with alternatives
Compare MPC860SRVR50D4R2 with alternatives