MPC8313VRAFFC vs MPC8306VMACFCA feature comparison

MPC8313VRAFFC NXP Semiconductors

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MPC8306VMACFCA NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Not Recommended Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGA-516 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 52 Weeks
Samacsys Manufacturer NXP
Address Bus Width
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 66.67 MHz
External Data Bus Width
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B369
JESD-609 Code e2 e1
Length 27 mm 19 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 516 369
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFBGA
Package Equivalence Code BGA516,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 2.55 mm 1.61 mm
Speed 333 MHz 200 MHz
Supply Voltage-Max 1.05 V
Supply Voltage-Min 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver (Sn/Ag) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 27 mm 19 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2

Compare MPC8313VRAFFC with alternatives

Compare MPC8306VMACFCA with alternatives