MPC8306VMACFCA vs MPC8306VMACDCA feature comparison

MPC8306VMACFCA Freescale Semiconductor

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MPC8306VMACDCA Freescale Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description LFBGA, 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369
Pin Count 369 369
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 66.67 MHz
External Data Bus Width
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B369 S-PBGA-B369
JESD-609 Code e1 e2
Length 19 mm 19 mm
Low Power Mode YES YES
Number of Terminals 369 369
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Seated Height-Max 1.61 mm 1.61 mm
Speed 200 MHz 200 MHz
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 19 mm 19 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Samacsys Manufacturer NXP
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) 40

Compare MPC8306VMACFCA with alternatives

Compare MPC8306VMACDCA with alternatives