MPC8313VRAFFC vs MPC8313CZQAFFA feature comparison

MPC8313VRAFFC NXP Semiconductors

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MPC8313CZQAFFA NXP Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Not Recommended Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGA-516 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 52 Weeks
Samacsys Manufacturer NXP
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 66.67 MHz
External Data Bus Width 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e2 e0
Length 27 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 516 516
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA HBGA
Package Equivalence Code BGA516,26X26,40 BGA516,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 333 MHz 333 MHz
Supply Voltage-Max 1.05 V 1.5 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Silver (Sn/Ag) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 2 2
Additional Feature ALSO REQUIRES 3.3V I/O SUPPLY

Compare MPC8313VRAFFC with alternatives

Compare MPC8313CZQAFFA with alternatives