MPC8245TZU266D vs 30130-23 feature comparison

MPC8245TZU266D Motorola Mobility LLC

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30130-23 Texas Instruments

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC NATIONAL SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description LBGA, BGA352,26X26,50 BGA, BGA352,26X26,50
Pin Count 352 352
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 2V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B352 S-PBGA-B352
Length 35 mm 35 mm
Low Power Mode YES YES
Number of Terminals 352 352
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm 2.23 mm
Speed 266 MHz 180 MHz
Supply Voltage-Max 1.9 V 3.05 V
Supply Voltage-Min 1.7 V 2.75 V
Supply Voltage-Nom 1.8 V 2.9 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 1 1
Pbfree Code No
JESD-609 Code e0
Operating Temperature-Max 70 °C
Operating Temperature-Min
Supply Current-Max 2250 mA
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD

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