MPC8245TZU266D
vs
KMPC8245LZU266D
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
BGA
Package Description
35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352
35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
Pin Count
352
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO OPERATES AT 2V SUPPLY
ALSO OPERATES AT 2V SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
JESD-609 Code
e0
e0
Length
35 mm
35 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
352
352
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA352,26X26,50
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.65 mm
1.65 mm
Speed
266 MHz
266 MHz
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
35 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
5
3
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