MPC603RRX300LC vs WED3C755E8M-350BC feature comparison

MPC603RRX300LC Freescale Semiconductor

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WED3C755E8M-350BC White Electronic Designs Corp

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC WHITE ELECTRONIC DESIGNS CORP
Part Package Code BGA
Package Description CERAMIC, BGA-255 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
Pin Count 255
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO YES
External Data Bus Width 64 64
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B255 R-CBGA-B255
JESD-609 Code e0
Length 21 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1
Number of Terminals 255 255
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm 3.85 mm
Speed 300 MHz 350 MHz
Supply Voltage-Nom 2.5 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Clock Frequency-Max 66 MHz
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Equivalence Code BGA255,16X16,50
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Temperature Grade COMMERCIAL

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Compare WED3C755E8M-350BC with alternatives