WED3C755E8M-350BC
vs
WEDMC64603RV200CM
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
WHITE MICROELECTRONICS
|
Package Description |
21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
|
CERAMIC, CGA-255
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66 MHz
|
200 MHz
|
External Data Bus Width |
64
|
32
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
NO
|
JESD-30 Code |
R-CBGA-B255
|
R-CPGA-P255
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
255
|
255
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
BGA
|
|
Package Equivalence Code |
BGA255,16X16,50
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.85 mm
|
|
Speed |
350 MHz
|
200 MHz
|
Supply Voltage-Max |
2.1 V
|
2.625 V
|
Supply Voltage-Min |
1.9 V
|
2.375 V
|
Supply Voltage-Nom |
2 V
|
2.5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Form |
BALL
|
PIN/PEG
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
BOTTOM
|
PERPENDICULAR
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
3
|
Additional Feature |
|
IC ALSO REQUIRES PLL SUPPLY VOLTAGE OF 2.375V TO 2.625V AND I/O SUPPLY VOLTAGE OF 3.135V TO 3.465V
|
|
|
|
Compare WED3C755E8M-350BC with alternatives