MPC5566MZP132
vs
MPC5566MZP132
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-416
|
27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-416
|
Pin Count |
416
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
NXP
|
NXP
|
Has ADC |
YES
|
YES
|
Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
ALSO REQUIRES 3.3V SUPPLY
|
Address Bus Width |
24
|
24
|
Bit Size |
32
|
32
|
Clock Frequency-Max |
20 MHz
|
20 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
32
|
32
|
JESD-30 Code |
S-PBGA-B416
|
S-PBGA-B416
|
JESD-609 Code |
e0
|
e0
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
416
|
416
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA416,26X26,40
|
BGA416,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
131072
|
131072
|
ROM (words) |
3145728
|
3145728
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
2.55 mm
|
2.55 mm
|
Speed |
132 MHz
|
132 MHz
|
Supply Current-Max |
820 mA
|
820 mA
|
Supply Voltage-Max |
1.65 V
|
1.65 V
|
Supply Voltage-Min |
1.35 V
|
1.35 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Tin/Lead/Silver (Sn/Pb/Ag)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
27 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER, RISC
|
Base Number Matches |
3
|
3
|
Factory Lead Time |
|
12 Weeks
|
Number of I/O Lines |
|
256
|
|
|
|
Compare MPC5566MZP132 with alternatives
Compare MPC5566MZP132 with alternatives