MPC5566MZP132
vs
MPC5554MZP132
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-416
27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416
Pin Count
416
416
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Has ADC
YES
YES
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
24
24
Bit Size
32
32
Clock Frequency-Max
20 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
YES
NO
External Data Bus Width
32
32
JESD-30 Code
S-PBGA-B416
S-PBGA-B416
JESD-609 Code
e0
e0
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of Terminals
416
416
On Chip Program ROM Width
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA416,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
245
Qualification Status
Not Qualified
RAM (bytes)
131072
ROM (words)
3145728
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.55 mm
2.55 mm
Speed
132 MHz
132 MHz
Supply Current-Max
820 mA
Supply Voltage-Max
1.65 V
1.65 V
Supply Voltage-Min
1.35 V
1.35 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
3
3
Compare MPC5566MZP132 with alternatives
Compare MPC5554MZP132 with alternatives