MPC5566MVR132
vs
MPC5566MZP132
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, BGA-416
|
27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-416
|
| Pin Count |
416
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
ALSO REQUIRES 3.3V SUPPLY
|
| Address Bus Width |
24
|
24
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PBGA-B416
|
S-PBGA-B416
|
| JESD-609 Code |
e1
|
e0
|
| Length |
27 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
416
|
416
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA416,26X26,40
|
BGA416,26X26,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
131072
|
131072
|
| ROM (words) |
3145728
|
3145728
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
2.55 mm
|
2.55 mm
|
| Speed |
132 MHz
|
132 MHz
|
| Supply Current-Max |
820 mA
|
820 mA
|
| Supply Voltage-Max |
1.65 V
|
1.65 V
|
| Supply Voltage-Min |
1.35 V
|
1.35 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
3
|
3
|
| Factory Lead Time |
|
16 Weeks
|
| Number of I/O Lines |
|
256
|
|
|
|
Compare MPC5566MVR132 with alternatives
Compare MPC5566MZP132 with alternatives