MP3011DQ-LF-Z
vs
NCP3065MNTXG
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MONOLITHIC POWER SYSTEMS INC
|
ONSEMI
|
| Part Package Code |
QFN
|
8 PIN DFN, 4x4
|
| Package Description |
3 X 3 MM, ROHS COMPLIANT, MO-220VEED-4, QFN-16
|
DFN-8
|
| Pin Count |
16
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
S-XQCC-N16
|
S-PDSO-N8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Multiplexed Display Capability |
NO
|
NO
|
| Number of Functions |
1
|
1
|
| Number of Segments |
2
|
2
|
| Number of Terminals |
16
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVSON
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max |
5.5 V
|
40 V
|
| Supply Voltage-Min |
2.5 V
|
3 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
3 mm
|
4 mm
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
488AF
|
| Factory Lead Time |
|
62 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
| fmax-Min |
|
0.19 MHz
|
|
|
|
Compare MP3011DQ-LF-Z with alternatives
Compare NCP3065MNTXG with alternatives