MM74HC273CW
vs
SN54LV273W
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Part Package Code
WAFER
DFP
Package Description
DIE,
DFP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
LV/LV-A/LVX/H
JESD-30 Code
X-XUUC-N
R-GDFP-F20
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
8
8
Number of Functions
1
1
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIE
DFP
Package Equivalence Code
DIE OR CHIP
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
FLATPACK
Propagation Delay (tpd)
170 ns
26 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2.7 V
Supply Voltage-Nom (Vsup)
4.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
NO LEAD
FLAT
Terminal Position
UPPER
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
24 MHz
100 MHz
Base Number Matches
1
1
Pin Count
20
Length
13.09 mm
Number of Terminals
20
Seated Height-Max
2.54 mm
Terminal Pitch
1.27 mm
Width
6.92 mm
Compare MM74HC273CW with alternatives
Compare SN54LV273W with alternatives