MM74HC273CW vs MC54HC273N feature comparison

MM74HC273CW Fairchild Semiconductor Corporation

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MC54HC273N Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP MOTOROLA INC
Part Package Code WAFER
Package Description DIE, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code X-XUUC-N R-PDIP-T20
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Propagation Delay (tpd) 170 ns 48 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 24 MHz 20 MHz
Base Number Matches 1 2
Length 26.415 mm
Load Capacitance (CL) 50 pF
Number of Terminals 20
Seated Height-Max 4.57 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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