MM74C910
vs
X2444PI
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
XICOR INC
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.41
|
|
Access Time-Max |
700 ns
|
|
I/O Type |
SEPARATE
|
|
JESD-30 Code |
R-XDIP-T18
|
R-PDIP-T8
|
JESD-609 Code |
e0
|
e0
|
Memory IC Type |
STANDARD SRAM
|
NON-VOLATILE SRAM
|
Memory Width |
4
|
16
|
Number of Terminals |
18
|
8
|
Number of Words |
64 words
|
16 words
|
Number of Words Code |
64
|
16
|
Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
64X4
|
16X16
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP18,.3
|
DIP8,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
SERIAL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.0003 A
|
|
Supply Current-Max |
0.0003 mA
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
NMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
1
|
Package Description |
|
MINI, PLASTIC, DIP-8
|
Memory Density |
|
256 bit
|
Number of Functions |
|
1
|
Number of Ports |
|
1
|
Output Enable |
|
NO
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
|
|
|
Compare MM74C910 with alternatives
Compare X2444PI with alternatives