MLG0603S1N8BTD25
vs
BSCQ000603031N8BHR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TDK CORP
PULSE ELECTRONICS CORP
Package Description
0201
CHIP
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8504.50.80.00
Factory Lead Time
12 Weeks
22 Weeks
Case/Size Code
0201
0201
Construction
Rectangular
Rectangular
Core Material
CERAMIC
Ceramic
DC Resistance
0.2 Ω
0.24 Ω
Inductance-Nom (L)
0.0018 µH
0.0018 µH
Inductor Application
RF INDUCTOR
RF INDUCTOR
Inductor Type
GENERAL PURPOSE INDUCTOR
GENERAL PURPOSE INDUCTOR
JESD-609 Code
e3
e3
Number of Functions
1
1
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.3 mm
0.3 mm
Package Length
0.6 mm
0.6 mm
Package Style
SMT
SMT
Package Width
0.3 mm
0.3 mm
Packing Method
TR, PUNCHED PAPER, 7 INCH
TR, Paper, 7 Inch
Quality Factor-Min (at L-nom)
4
Rated Current-Max
0.5 A
0.46 A
Reference Standard
AEC-Q200
Self Resonance Frequency
8500 MHz
10000 MHz
Shape/Size Description
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Shielded
NO
NO
Special Feature
0.1NH IS THE TOLERANCE
Surface Mount
YES
YES
Terminal Finish
TIN OVER NICKEL
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Placement
DUAL ENDED
DUAL ENDED
Terminal Shape
WRAPAROUND
WRAPAROUND
Test Frequency
100 MHz
500 MHz
Tolerance
0.06%
5.5556%
Base Number Matches
1
4
Compare MLG0603S1N8BTD25 with alternatives
Compare BSCQ000603031N8BHR with alternatives