ML501R-6CP vs DP8463BN feature comparison

ML501R-6CP RF Micro Devices Inc

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DP8463BN Texas Instruments

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRO LINEAR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP28,.6 DIP,
Pin Count 28
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Drive Type WINCHESTER
Interface IC Type READ WRITE AMPLIFIER CIRCUIT DATA SYNCHRONIZER OR ENDEC
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e0
Number of Channels 6
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 25 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Supply Voltage1-Max 13.2 V
Supply Voltage1-Min 10.8 V
Supply Voltage1-Nom 12 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 3
Length 35.725 mm
Seated Height-Max 5.33 mm
Width 15.24 mm

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