ML4431CQ
vs
SSI32R511-8F
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICRO LINEAR CORP
|
SILICON SYSTEMS INC
|
Part Package Code |
QFJ
|
|
Package Description |
QCCJ,
|
DFP, FL32,.5
|
Pin Count |
32
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Drive Type |
WINCHESTER
|
WINCHESTER
|
Interface IC Type |
HEAD POSITIONING CIRCUIT
|
READ WRITE AMPLIFIER CIRCUIT
|
JESD-30 Code |
R-PQCC-J32
|
R-PQFP-F32
|
JESD-609 Code |
e0
|
e0
|
Length |
14.045 mm
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
DFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Supply Voltage1-Max |
13.2 V
|
13.2 V
|
Supply Voltage1-Min |
10.8 V
|
10.8 V
|
Supply Voltage1-Nom |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
J BEND
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.505 mm
|
|
Base Number Matches |
1
|
1
|
Number of Channels |
|
8
|
Package Equivalence Code |
|
FL32,.5
|
Supply Current-Max |
|
35 mA
|
Technology |
|
BIPOLAR
|
|
|
|
Compare ML4431CQ with alternatives
Compare SSI32R511-8F with alternatives