MIC58P01AJBQ vs MIC5801YWM feature comparison

MIC58P01AJBQ Microchip Technology Inc

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MIC5801YWM Rochester Electronics LLC

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Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer MICREL INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP SOIC
Package Description DIP, LEAD FREE, SOIC-24
Pin Count 22 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Built-in Protections TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE TRANSIENT
Interface IC Type LATCH BASED PERIPHERAL DRIVER LATCH BASED PERIPHERAL DRIVER
JESD-30 Code R-GDIP-T22 R-PDSO-G24
Length 27.178 mm 15.4 mm
Number of Functions 1 8
Number of Terminals 22 24
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Current Flow Direction SINK SINK
Output Peak Current Limit-Nom 0.5 A
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP22,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 2.65 mm
Supply Voltage-Min 3 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 10.16 mm 7.5 mm
Base Number Matches 2 3
Pbfree Code No
Rohs Code Yes
JESD-609 Code e3
Moisture Sensitivity Level 2
Technology BIMOS
Terminal Finish MATTE TIN

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