MIC5801YWM
vs
MIC5801BN
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MICREL INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
LEAD FREE, SOIC-24
|
PLASTIC, DIP-22
|
| Pin Count |
24
|
22
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Built-in Protections |
TRANSIENT
|
TRANSIENT
|
| Interface IC Type |
LATCH BASED PERIPHERAL DRIVER
|
LATCH BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDIP-T22
|
| JESD-609 Code |
e3
|
e0
|
| Length |
15.4 mm
|
27.559 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
8
|
8
|
| Number of Terminals |
24
|
22
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current Flow Direction |
SINK
|
SINK
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
5.08 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIMOS
|
BIMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
10.16 mm
|
| Base Number Matches |
3
|
3
|
| Driver Number of Bits |
|
8
|
| Input Characteristics |
|
STANDARD
|
| Output Characteristics |
|
OPEN-COLLECTOR
|
| Output Current-Max |
|
0.35 A
|
| Output Peak Current Limit-Nom |
|
0.5 A
|
| Output Polarity |
|
INVERTED
|
| Package Equivalence Code |
|
DIP22,.4
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MIC5801YWM with alternatives
Compare MIC5801BN with alternatives