MIC5841YWM-TR
vs
MIC5841YV
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
LEAD FREE, SOIC-18
|
LEAD FREE, PLASTIC, LCC-20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
16 Weeks, 3 Days
|
7 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Built-in Protections |
TRANSIENT
|
TRANSIENT
|
| Driver Number of Bits |
8
|
8
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
SIPO BASED PERIPHERAL DRIVER
|
SIPO BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PDSO-G18
|
S-PQCC-J20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
11.55 mm
|
8.94 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
18
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current Flow Direction |
SINK
|
SINK
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Equivalence Code |
SOP18,.40
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
4.57 mm
|
| Supply Current-Max |
16 mA
|
16 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
7.5 mm
|
8.94 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare MIC5841YWM-TR with alternatives
Compare MIC5841YV with alternatives