MIC5801BWM vs MIC5801CN feature comparison

MIC5801BWM Rochester Electronics LLC

Buy Now Datasheet

MIC5801CN Microchip Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC MICREL INC
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP22,.4
Pin Count 24 22
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Built-in Protections TRANSIENT TRANSIENT
Interface IC Type LATCH BASED PERIPHERAL DRIVER LATCH BASED PERIPHERAL DRIVER
JESD-30 Code R-PDSO-G24 R-PDIP-T22
JESD-609 Code e0 e0
Length 15.4 mm 27.559 mm
Moisture Sensitivity Level 1
Number of Functions 8 1
Number of Terminals 24 22
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Current Flow Direction SINK SINK
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 5.08 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology BIMOS BIMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.5 mm 10.16 mm
Base Number Matches 1 1
Driver Number of Bits 8
Input Characteristics STANDARD
Output Characteristics OPEN-COLLECTOR
Output Current-Max 0.35 A
Output Peak Current Limit-Nom 0.5 A
Output Polarity INVERTED
Package Equivalence Code DIP22,.4
Supply Current-Max 16 mA
Supply Voltage-Max 12 V

Compare MIC5801BWM with alternatives

Compare MIC5801CN with alternatives