MIC5801CN vs UCS5801H883 feature comparison

MIC5801CN Microchip Technology Inc

Buy Now Datasheet

UCS5801H883 Allegro MicroSystems LLC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICREL INC ALLEGRO MICROSYSTEMS LLC
Part Package Code DIP DIP
Package Description DIP, DIP22,.4 DIP, DIP22,.4
Pin Count 22 22
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Built-in Protections TRANSIENT TRANSIENT
Driver Number of Bits 8 8
Input Characteristics STANDARD
Interface IC Type LATCH BASED PERIPHERAL DRIVER LATCH BASED PERIPHERAL DRIVER
JESD-30 Code R-PDIP-T22 R-CDIP-T22
JESD-609 Code e0
Length 27.559 mm
Number of Functions 1 1
Number of Terminals 22 22
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Characteristics OPEN-COLLECTOR
Output Current Flow Direction SINK SOURCE
Output Current-Max 0.35 A 0.35 A
Output Peak Current Limit-Nom 0.5 A 0.5 A
Output Polarity INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP22,.4 DIP22,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 16 mA
Supply Voltage-Max 12 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BIMOS BIMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 10.16 mm 10.16 mm
Base Number Matches 2 1
Screening Level MIL-STD-883 Class B

Compare MIC5801CN with alternatives

Compare UCS5801H883 with alternatives