MIC5801BWM
vs
UCN5801LWTR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ALLEGRO MICROSYSTEMS LLC
Part Package Code
SOIC
SOIC
Package Description
SOIC-24
SOP, SOP24,.4
Pin Count
24
24
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microchip
Built-in Protections
TRANSIENT
TRANSIENT
Interface IC Type
LATCH BASED PERIPHERAL DRIVER
LATCH BASED PERIPHERAL DRIVER
JESD-30 Code
R-PDSO-G24
R-PDSO-G24
Length
15.4 mm
15.4 mm
Number of Functions
8
1
Number of Terminals
24
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-20 °C
Output Current Flow Direction
SINK
SINK
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Seated Height-Max
2.65 mm
2.65 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
BIMOS
BIMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.5 mm
7.5 mm
Base Number Matches
3
1
Rohs Code
Driver Number of Bits
8
JESD-609 Code
e0
Output Current-Max
0.35 A
Output Peak Current Limit-Nom
0.5 A
Package Equivalence Code
SOP24,.4
Qualification Status
Not Qualified
Terminal Finish
TIN LEAD
Compare MIC5801BWM with alternatives
Compare UCN5801LWTR with alternatives