MH88612BV-2
vs
LE57D111BTC
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MITEL SEMICONDUCTOR
|
MICROSEMI CORP
|
| Part Package Code |
SIP
|
QFP
|
| Package Description |
, SIP20,.12
|
HTQFP,
|
| Pin Count |
20
|
44
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Battery Feed |
CONSTANT CURRENT
|
|
| Battery Supply |
-48 V
|
|
| Hybrid |
2-4 CONVERSION
|
|
| JESD-30 Code |
R-PSIP-T20
|
S-PQFP-G44
|
| JESD-609 Code |
e0
|
e3
|
| Neg Supply Voltage-Nom |
-5 V
|
|
| Noise-Max |
14 dBrnC
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
44
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PSRR-Min |
26 dB
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
SIP20,.12
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
HYBRID
|
|
| Telecom IC Type |
SLIC
|
SLIC
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.8 mm
|
| Terminal Position |
SINGLE
|
QUAD
|
| Base Number Matches |
2
|
2
|
| Length |
|
10 mm
|
| Package Code |
|
HTQFP
|
| Seated Height-Max |
|
1.2 mm
|
| Width |
|
10 mm
|
|
|
|
Compare MH88612BV-2 with alternatives
Compare LE57D111BTC with alternatives