LE57D111BTC
vs
LE79555-1VC
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
LEGERITY INC
|
Package Description |
HTQFP,
|
TQFP,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
7 Weeks
|
|
Battery Feed |
CONSTANT CURRENT
|
|
Battery Supply |
-39 TO -58 V
|
|
Hybrid |
2-4 CONVERSION
|
|
JESD-30 Code |
S-PQFP-G44
|
S-PQFP-G44
|
JESD-609 Code |
e3
|
e3
|
Length |
10 mm
|
10 mm
|
Noise-Max |
12 dBrnC
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
44
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
PSRR-Min |
28 dB
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTQFP
|
TQFP
|
Package Equivalence Code |
TQFP44,.47SQ,32
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE
|
FLATPACK, THIN PROFILE
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Current-Max |
12 mA
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
SLIC
|
SLIC
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
10 mm
|
10 mm
|
Base Number Matches |
4
|
3
|
Rohs Code |
|
No
|
Part Package Code |
|
QFP
|
Pin Count |
|
44
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
235
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare LE57D111BTC with alternatives
Compare LE79555-1VC with alternatives