MG25Q6ES50 vs BSM25GD120DN2E3224 feature comparison

MG25Q6ES50 Toshiba America Electronic Components

Buy Now Datasheet

BSM25GD120DN2E3224 Infineon Technologies AG

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP INFINEON TECHNOLOGIES AG
Reach Compliance Code unknown not_compliant
Additional Feature HIGH SPEED SWITCHING
Case Connection ISOLATED ISOLATED
Collector Current-Max (IC) 35 A 35 A
Collector-Emitter Voltage-Max 1200 V 1200 V
Configuration BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE
JESD-30 Code R-PDIP-P24 R-XUFM-X17
Number of Elements 6 6
Number of Terminals 24 17
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLANGE MOUNT
Polarity/Channel Type N-CHANNEL N-CHANNEL
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form PIN/PEG UNSPECIFIED
Terminal Position DUAL UPPER
Transistor Application MOTOR CONTROL
Transistor Element Material SILICON SILICON
Turn-off Time-Nom (toff) 600 ns 450 ns
Turn-on Time-Nom (ton) 200 ns 140 ns
Base Number Matches 2 2
Rohs Code Yes
Package Description ECONOPACK-17
Pin Count 17
ECCN Code EAR99
Samacsys Manufacturer Infineon
Gate-Emitter Voltage-Max 20 V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Dissipation-Max (Abs) 200 W
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
VCEsat-Max 3.2 V

Compare MG25Q6ES50 with alternatives

Compare BSM25GD120DN2E3224 with alternatives