MCP6V26T-EMD
vs
MCP6V28-EMNY
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DFN
|
DFN
|
Package Description |
HVSON,
|
HVSON,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Common-mode Reject Ratio-Nom |
136 dB
|
136 dB
|
Input Offset Voltage-Max |
2 µV
|
2 µV
|
JESD-30 Code |
S-PDSO-N8
|
R-PDSO-N8
|
Length |
4 mm
|
3 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
0.8 mm
|
Slew Rate-Nom |
1 V/us
|
1 V/us
|
Supply Voltage Limit-Max |
6.5 V
|
6.5 V
|
Supply Voltage-Nom (Vsup) |
2.3 V
|
2.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Unity Gain BW-Nom |
2000
|
2000
|
Width |
4 mm
|
2 mm
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e4
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare MCP6V26T-EMD with alternatives
Compare MCP6V28-EMNY with alternatives