MCP6V28-EMNY
vs
MCP6V26-EMNY
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DFN
DFN
Package Description
HVSON,
HVSON,
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Common-mode Reject Ratio-Nom
136 dB
136 dB
Input Offset Voltage-Max
2 µV
2 µV
JESD-30 Code
R-PDSO-N8
R-PDSO-N8
JESD-609 Code
e4
e4
Length
3 mm
3 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
HVSON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
0.8 mm
Slew Rate-Nom
1 V/us
1 V/us
Supply Voltage Limit-Max
6.5 V
6.5 V
Supply Voltage-Nom (Vsup)
2.3 V
2.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
2000
2000
Width
2 mm
2 mm
Base Number Matches
1
1
Compare MCP6V28-EMNY with alternatives
Compare MCP6V26-EMNY with alternatives