MCP2510T-E/SOA03
vs
MCP2510-E/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Not Recommended
Not Recommended
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
0.300 INCH, PLASTIC, SOIC-18
0.300 INCH, PLASTIC, DIP-18
Pin Count
18
18
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.39.00.01
Address Bus Width
Boundary Scan
NO
NO
Clock Frequency-Max
25 MHz
25 MHz
Communication Protocol
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; ADCCP
SYNC; BIT ;BYTE
Data Encoding/Decoding Method
NRZ
NRZ
Data Transfer Rate-Max
0.125 MBps
0.125 MBps
External Data Bus Width
JESD-30 Code
R-PDSO-G18
R-PDIP-T18
JESD-609 Code
e3
e3
Length
11.55 mm
22.86 mm
Low Power Mode
YES
YES
Number of Serial I/Os
1
1
Number of Terminals
18
18
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
4.32 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.5 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, LAN
SERIAL IO/COMMUNICATION CONTROLLER, LAN
Base Number Matches
1
1
ECCN Code
EAR99
Factory Lead Time
4 Weeks
Date Of Intro
1999-06-07
Samacsys Manufacturer
Microchip
Bus Compatibility
SPI
On Chip Data RAM Width
8
Package Equivalence Code
DIP18,.3
RAM (words)
14
Screening Level
TS 16949
Supply Current-Max
10 mA
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Compare MCP2510-E/P with alternatives