MCP2510-E/P
vs
MCP2510I/ST
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Not Recommended
Not Recommended
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
TSSOP
Package Description
0.300 INCH, PLASTIC, DIP-18
TSSOP,
Pin Count
18
20
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
Date Of Intro
1999-06-07
1999-06-07
Samacsys Manufacturer
Microchip
Address Bus Width
Boundary Scan
NO
NO
Bus Compatibility
SPI
SPI
Clock Frequency-Max
25 MHz
25 MHz
Communication Protocol
SYNC; BIT ;BYTE
SYNC; BIT
Data Encoding/Decoding Method
NRZ
NRZ
Data Transfer Rate-Max
0.125 MBps
0.125 MBps
External Data Bus Width
JESD-30 Code
R-PDIP-T18
R-PDSO-G20
JESD-609 Code
e3
e3
Length
22.86 mm
6.5 mm
Low Power Mode
YES
YES
Number of Serial I/Os
1
1
Number of Terminals
18
20
On Chip Data RAM Width
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Equivalence Code
DIP18,.3
TSSOP20,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (words)
14
14
Screening Level
TS 16949
TS 16949
Seated Height-Max
4.32 mm
1.2 mm
Supply Current-Max
10 mA
10 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
4.4 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, LAN
SERIAL IO/COMMUNICATION CONTROLLER, LAN
Base Number Matches
1
1
Additional Feature
OPERATES AT 3V MINIMUM SUPPLY @ 16 MHZ
Moisture Sensitivity Level
1
Compare MCP2510-E/P with alternatives
Compare MCP2510I/ST with alternatives