MCP2510I/ST
vs
MCP2510-E/ST
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
TSSOP
TSSOP
Package Description
TSSOP,
TSSOP,
Pin Count
20
20
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
Date Of Intro
1999-06-07
Additional Feature
OPERATES AT 3V MINIMUM SUPPLY @ 16 MHZ
Address Bus Width
Boundary Scan
NO
NO
Bus Compatibility
SPI
Clock Frequency-Max
25 MHz
25 MHz
Communication Protocol
SYNC; BIT
Data Encoding/Decoding Method
NRZ
NRZ
Data Transfer Rate-Max
0.125 MBps
0.125 MBps
External Data Bus Width
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e3
e3
Length
6.5 mm
6.5 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
1
Number of Serial I/Os
1
1
Number of Terminals
20
20
On Chip Data RAM Width
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP20,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (words)
14
Screening Level
TS 16949
Seated Height-Max
1.2 mm
1.2 mm
Supply Current-Max
10 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4.4 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, LAN
SERIAL IO/COMMUNICATION CONTROLLER, LAN
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare MCP2510I/ST with alternatives
Compare MCP2510-E/ST with alternatives