MCP23S09-E/P
vs
PCA9534ADBT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
TEXAS INSTRUMENTS INC
Part Package Code
DIP
SOIC
Package Description
0.300 INCH, LEAD FREE, PLASTIC, DIP-18
SSOP,
Pin Count
18
16
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
6 Weeks
Samacsys Manufacturer
Microchip
Clock Frequency-Max
10 MHz
0.4 MHz
External Data Bus Width
JESD-30 Code
R-XDIP-T18
R-PDSO-G16
JESD-609 Code
e3
Length
22.86 mm
6.2 mm
Number of Bits
8
Number of I/O Lines
8
8
Number of Ports
1
1
Number of Terminals
18
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIP
SSOP
Package Equivalence Code
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.334 mm
2 mm
Supply Current-Max
1 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
1.8 V
2.3 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
5.3 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
1
Compare MCP23S09-E/P with alternatives
Compare PCA9534ADBT with alternatives