MCP23S09-E/P
vs
MCP23009-E/MG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
QFN
Package Description
0.300 INCH, LEAD FREE, PLASTIC, DIP-18
QFN-16
Pin Count
18
16
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
6 Weeks
11 Weeks
Samacsys Manufacturer
Microchip
Microchip
Clock Frequency-Max
10 MHz
10 MHz
External Data Bus Width
JESD-30 Code
R-XDIP-T18
S-PQCC-N16
JESD-609 Code
e3
e3
Length
22.86 mm
3 mm
Number of Bits
8
8
Number of I/O Lines
8
8
Number of Ports
1
8
Number of Terminals
18
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIP
HVQCCN
Package Equivalence Code
DIP18,.3
LCC16,.12SQ,20
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.334 mm
0.9 mm
Supply Current-Max
1 mA
1 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
0.5 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
3 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
1
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare MCP23S09-E/P with alternatives
Compare MCP23009-E/MG with alternatives