MCP23009T-E/SO
vs
PCA9534DBG4
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP, SOP18,.4
|
SSOP, SSOP16,.3
|
Pin Count |
18
|
16
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
10 MHz
|
0.4 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDSO-G18
|
R-PDSO-G16
|
JESD-609 Code |
e3
|
e4
|
Length |
11.55 mm
|
6.2 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
8
|
8
|
Number of I/O Lines |
8
|
8
|
Number of Ports |
8
|
1
|
Number of Terminals |
18
|
16
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SSOP
|
Package Equivalence Code |
SOP18,.4
|
SSOP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
2 mm
|
Supply Current-Max |
1 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
1.8 V
|
2.3 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
7.5 mm
|
5.3 mm
|
uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCP23009T-E/SO with alternatives
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