MCP23009T-E/SO
vs
PCF8574AT/3,118
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOP
Package Description
SOP, SOP18,.4
7.50 MM, PLASTIC, MS-013, SOT-162-1, SO-16
Pin Count
18
16
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Clock Frequency-Max
10 MHz
0.1 MHz
External Data Bus Width
JESD-30 Code
R-PDSO-G18
R-PDSO-G16
JESD-609 Code
e3
e4
Length
11.55 mm
10.3 mm
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of I/O Lines
8
8
Number of Ports
8
1
Number of Terminals
18
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP18,.4
SOP16,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
2.65 mm
2.65 mm
Supply Current-Max
1 mA
100 mA
Supply Voltage-Max
5.5 V
6 V
Supply Voltage-Min
1.8 V
2.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
7.5 mm
7.5 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
1
Manufacturer Package Code
SOT162-1
Samacsys Manufacturer
NXP
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