MCP23008-E/P vs MCP23009T-E/SS feature comparison

MCP23008-E/P Microchip Technology Inc

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MCP23009T-E/SS Microchip Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP SSOP
Package Description DIP-18 5.30 MM, LEAD FREE, PLASTIC, SSOP-20
Pin Count 18 20
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microchip Microchip
Clock Frequency-Max 10 MHz 10 MHz
External Data Bus Width
JESD-30 Code R-PDIP-T18 R-PDSO-G20
JESD-609 Code e3 e3
Length 22.86 mm 7.2 mm
Number of Bits 8 8
Number of I/O Lines 8 8
Number of Ports 8 8
Number of Terminals 18 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP18,.3 SSOP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2 mm
Supply Current-Max 1 mA 1 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 1.8 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN Matte Tin (Sn) - annealed
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.3 mm
uPs/uCs/Peripheral ICs Type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches 1 1
Factory Lead Time 10 Weeks
Moisture Sensitivity Level 2
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

Compare MCP23008-E/P with alternatives

Compare MCP23009T-E/SS with alternatives