MCP2022T-330E/ST
vs
935277292118
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NXP SEMICONDUCTORS
Part Package Code
TSSOP
Package Description
HTSSOP,
SOP,
Pin Count
14
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microchip
JESD-30 Code
R-PDSO-G14
R-PDSO-G8
JESD-609 Code
e3
Length
5 mm
4.9 mm
Number of Functions
1
1
Number of Terminals
14
8
Number of Transceivers
1
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Screening Level
TS 16949
AEC-Q100
Seated Height-Max
1.2 mm
1.75 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
YES
YES
Telecom IC Type
LIN TRANSCEIVER
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
3.9 mm
Base Number Matches
1
1
Compare MCP2022T-330E/ST with alternatives
Compare 935277292118 with alternatives