MCP17128CN vs XC17128LPD8C feature comparison

MCP17128CN Motorola Semiconductor Products

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XC17128LPD8C AMD Xilinx

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC XILINX INC
Package Description DIP, DIP, DIP8,.3
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.51
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 9.78 mm 9.3599 mm
Memory Density 131072 bit 131072 bit
Memory IC Type OTP ROM CONFIGURATION MEMORY
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX1 128KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 4.5974 mm
Supply Voltage-Max (Vsup) 6 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Rohs Code No
Part Package Code DIP
Pin Count 8
Clock Frequency-Max (fCLK) 10 MHz
I/O Type COMMON
JESD-609 Code e0
Moisture Sensitivity Level 1
Package Equivalence Code DIP8,.3
Peak Reflow Temperature (Cel) 225
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

Compare MCP17128CN with alternatives

Compare XC17128LPD8C with alternatives