MCP0805F301PB-T vs CIC21J601NE feature comparison

MCP0805F301PB-T AEM Inc

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CIC21J601NE Samsung Electro-Mechanics

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer AEM INC SAMSUNG ELECTRO-MECHANICS
Package Description 0805 EIA STD PACKAGE SIZE 0805, 2 PIN
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8504.50.80.00 8504.50.80.00
Case Code 0805 0805
Construction Multilayer Chip Chip Bead
DC Resistance-Max 0.15 Ω 0.15 Ω
Filter Type FERRITE CHIP FERRITE CHIP
Frequency-Max 100 MHz 100 MHz
Frequency-Min 100 MHz 100 MHz
Height 0.9 mm 0.9 mm
JESD-609 Code e3 e3
Length 2 mm 2 mm
Mounting Type SURFACE MOUNT SURFACE MOUNT
Number of Functions 1 1
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Impedance 300 OHM Ω 600 OHM Ω
Packing Method BULK TAPE AND REEL
Rated Current 1 A 1 A
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Width 1.25 mm 1.25 mm
Base Number Matches 1 2
Samacsys Manufacturer SAMSUNG

Compare MCP0805F301PB-T with alternatives

Compare CIC21J601NE with alternatives