MCM69F817ZP6 vs IS61DDP2B21M36A-400B4L feature comparison

MCM69F817ZP6 Motorola Semiconductor Products

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IS61DDP2B21M36A-400B4L Integrated Silicon Solution Inc

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA INC INTEGRATED SILICON SOLUTION INC
Package Description BGA, LBGA,
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 6 ns 0.45 ns
JESD-30 Code R-PBGA-B119 R-PBGA-B165
JESD-609 Code e0
Length 22 mm 15 mm
Memory Density 4718592 bit 37748736 bit
Memory IC Type CACHE SRAM DDR SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Ports 1
Number of Terminals 119 165
Number of Words 262144 words 1048576 words
Number of Words Code 256000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 1MX36
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 2.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 1.89 V
Supply Voltage-Min (Vsup) 3.135 V 1.71 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology MOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 13 mm
Base Number Matches 3 1
Part Package Code BGA
Pin Count 165
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare MCM69F817ZP6 with alternatives

Compare IS61DDP2B21M36A-400B4L with alternatives