MCM69F817ZP6
vs
IS61DDP2B21M36A-400B4L
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MOTOROLA INC
|
INTEGRATED SILICON SOLUTION INC
|
Package Description |
BGA,
|
LBGA,
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
6 ns
|
0.45 ns
|
JESD-30 Code |
R-PBGA-B119
|
R-PBGA-B165
|
JESD-609 Code |
e0
|
|
Length |
22 mm
|
15 mm
|
Memory Density |
4718592 bit
|
37748736 bit
|
Memory IC Type |
CACHE SRAM
|
DDR SRAM
|
Memory Width |
18
|
36
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
|
Number of Terminals |
119
|
165
|
Number of Words |
262144 words
|
1048576 words
|
Number of Words Code |
256000
|
1000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
256KX18
|
1MX36
|
Output Characteristics |
3-STATE
|
|
Output Enable |
YES
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.4 mm
|
1.4 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
1.89 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
1.71 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
MOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
14 mm
|
13 mm
|
Base Number Matches |
3
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
165
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MCM69F817ZP6 with alternatives
Compare IS61DDP2B21M36A-400B4L with alternatives