MCM69F817ZP6
vs
K7I163684B-FC330
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
SAMSUNG SEMICONDUCTOR INC
Package Description
BGA,
LBGA,
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6 ns
0.45 ns
JESD-30 Code
R-PBGA-B119
R-PBGA-B165
JESD-609 Code
e0
e0
Length
22 mm
15 mm
Memory Density
4718592 bit
18874368 bit
Memory IC Type
CACHE SRAM
DDR SRAM
Memory Width
18
36
Number of Functions
1
1
Number of Ports
1
Number of Terminals
119
165
Number of Words
262144 words
524288 words
Number of Words Code
256000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX18
512KX36
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
1.9 V
Supply Voltage-Min (Vsup)
3.135 V
1.7 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
MOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
13 mm
Base Number Matches
3
1
Part Package Code
BGA
Pin Count
165
Additional Feature
PIPELINED ARCHITECTURE
Compare MCM69F817ZP6 with alternatives
Compare K7I163684B-FC330 with alternatives