MCM69F817ZP6
vs
KM732V789H-67
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
SAMSUNG SEMICONDUCTOR INC
Package Description
BGA,
BGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6 ns
JESD-30 Code
R-PBGA-B119
JESD-609 Code
e0
Length
22 mm
Memory Density
4718592 bit
Memory IC Type
CACHE SRAM
Memory Width
18
Number of Functions
1
Number of Ports
1
Number of Terminals
119
Number of Words
262144 words
Number of Words Code
256000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
256KX18
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
2.4 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
MOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
14 mm
Base Number Matches
3
1
Part Package Code
BGA
Pin Count
119
Compare MCM69F817ZP6 with alternatives
Compare KM732V789H-67 with alternatives