MCM64T116DG60 vs KMM965G112QN-G0 feature comparison

MCM64T116DG60 Motorola Mobility LLC

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KMM965G112QN-G0 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC SAMSUNG SEMICONDUCTOR INC
Part Package Code DIMM
Package Description DIMM, DIMM168 DIMM, DIMM144,32
Pin Count 168
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FAST PAGE DUAL BANK PAGE BURST
Access Time-Max 60 ns 7 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH AUTO/SELF REFRESH
Alternate Memory Width 32
I/O Type COMMON COMMON
JESD-30 Code R-XDMA-N168 R-XZMA-N144
Memory Density 67108864 bit 67108864 bit
Memory IC Type FAST PAGE DRAM MODULE SYNCHRONOUS GRAPHICS RAM MODULE
Memory Width 64 64
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 168 144
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX64 1MX64
Output Characteristics 3-STATE 3-STATE
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Equivalence Code DIMM168 DIMM144,32
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Refresh Cycles 1024 2048
Seated Height-Max 31.877 mm
Self Refresh NO YES
Standby Current-Max 0.076 A 0.008 A
Supply Current-Max 0.828 mA 0.49 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position DUAL ZIG-ZAG
Base Number Matches 3 1
Clock Frequency-Max (fCLK) 100 MHz

Compare MCM64T116DG60 with alternatives

Compare KMM965G112QN-G0 with alternatives