KMM965G112QN-G0
vs
MT4LDT164G-7X
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MICRON TECHNOLOGY INC
Package Description
DIMM, DIMM144,32
DIMM-168
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
DUAL BANK PAGE BURST
FAST PAGE WITH EDO
Access Time-Max
7 ns
70 ns
Additional Feature
AUTO/SELF REFRESH
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-XZMA-N144
R-XDMA-N168
Memory Density
67108864 bit
67108864 bit
Memory IC Type
SYNCHRONOUS GRAPHICS RAM MODULE
EDO DRAM MODULE
Memory Width
64
64
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
168
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX64
1MX64
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Equivalence Code
DIMM144,32
DIMM168
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
2048
1024
Self Refresh
YES
Standby Current-Max
0.008 A
0.002 A
Supply Current-Max
0.49 mA
0.62 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.8 mm
1.27 mm
Terminal Position
ZIG-ZAG
DUAL
Base Number Matches
1
1
Rohs Code
Part Package Code
DIMM
Pin Count
168
Alternate Memory Width
32
Moisture Sensitivity Level
1
Seated Height-Max
25.654 mm
Compare KMM965G112QN-G0 with alternatives
Compare MT4LDT164G-7X with alternatives