MCM63F919ZP8 vs MT58L256L36FT-8.5 feature comparison

MCM63F919ZP8 Freescale Semiconductor

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MT58L256L36FT-8.5 Micron Technology Inc

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MICRON TECHNOLOGY INC
Part Package Code BGA QFP
Package Description BGA, BGA119,7X17,50 PLASTIC, TQFP-100
Pin Count 119 100
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 8 ns 8.5 ns
Additional Feature FLOW-THROUGH ARCHTECTURE FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK) 100 MHz 100 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B119 R-PQFP-G100
Length 22 mm 20 mm
Memory Density 9437184 bit 9437184 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 119 100
Number of Words 524288 words 262144 words
Number of Words Code 512000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX18 256KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Equivalence Code BGA119,7X17,50 QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 14 mm 14 mm
Base Number Matches 4 2
Rohs Code No
JESD-609 Code e0
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.325 mA
Terminal Finish Tin/Lead (Sn/Pb)

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Compare MT58L256L36FT-8.5 with alternatives