MCM63F919ZP8
vs
TC55VD836FF-143
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TOSHIBA CORP
Package Description
BGA, BGA119,7X17,50
14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
8 ns
4 ns
Additional Feature
FLOW-THROUGH ARCHTECTURE
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
R-PQFP-G100
Length
22 mm
20 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
CACHE SRAM
STANDARD SRAM
Memory Width
18
36
Number of Functions
1
1
Number of Terminals
119
100
Number of Words
524288 words
262144 words
Number of Words Code
512000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX18
256KX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LQFP
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
1.7 mm
Supply Voltage-Max (Vsup)
3.465 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Width
14 mm
14 mm
Base Number Matches
2
1
Rohs Code
Part Package Code
QFP
Pin Count
100
JESD-609 Code
e0
Peak Reflow Temperature (Cel)
240
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MCM63F919ZP8 with alternatives
Compare TC55VD836FF-143 with alternatives